Job Responsibility:
The Package Core Technology group is advancing predictive modeling capabilities for semiconductor package reliability through microstructure-based simulation of solder joint behavior. Building on a successful collaboration with the University of Maryland, the next phase of this research focuses on modeling the evolution of solder microstructures and their impact on long-term joint degradation.
- Develop algorithms that simulate the evolution of solder joint microstructures under mechanical and thermal loading conditions.
- Translate existing theoretical models and scientific formulations into robust computational implementations within NXP's simulation framework.
- Enhance existing simulation tools that generate realistic solder microstructures and assign material properties to grains and grain boundaries.
- Investigate degradation mechanisms in solder joints and evaluate their influence on package reliability and performance.
- Validate simulation results against theoretical expectations and available experimental or literature data to ensure model accuracy.
Project Deliverables
- Review and understand the theoretical framework governing solder microstructure evolution and degradation.
- Implement microstructure evolution algorithms in the existing simulation environment.
- Develop validation methodologies and benchmark cases for model verification.
- Analyze the relationship between microstructural changes and solder joint reliability.
- Deliver a final report and presentation documenting methodology, implementation, validation results, and recommendations for future development.
Learning Objectives
During this internship, the student will gain experience in:
- Advanced material modeling for semiconductor packaging applications.
- Microstructure-based simulation and computational materials science.
- Mechanical and thermal reliability analysis of electronic packages.
- Scientific software development, algorithm design, and model validation.
- Translating academic research into industrial simulation tools and engineering solutions.
Job Qualification:
- The candidate must be pursuing a Master's degree in Mechanical Engineering, Materials Science, Physics, Computational Engineering, Applied Mathematics, Electrical Engineering, or a related technical discipline.
- Strong interest in materials modeling, reliability engineering, computational mechanics, or semiconductor packaging technologies.
- Basic understanding of material behavior, deformation mechanisms, fracture, fatigue, or microstructural evolution is highly desirable.
- Experience with programming and scientific computing using Python, MATLAB, C++, or similar languages.
- Familiarity with numerical modeling techniques such as finite element methods, computational materials science, or multi-physics simulations is a plus.
- Ability to interpret scientific literature and translate theoretical concepts into computational algorithms.
- Strong analytical and problem-solving skills with attention to model validation and accuracy.
- Self-motivated, proactive, and comfortable working independently while collaborating with research and engineering teams.
- Good written and verbal communication skills, including technical reporting and presentation.
Career Development Opportunities
Bright Minds. Bright Futures.
We believe that a key component to growing our business is to develop our people. To enable you to grow your career at NXP, we offer online and offline learning opportunities to help you develop some of your core and professional skills.
Visit our careers website for more job information: https://nxp.wd3.myworkdayjobs.com/careers
Commitment At NXP
We recognize NXP is a powerful change agent as we continue to deliver innovative solutions that advance a more sustainable future. We remain steadfast in our commitment to sustainability and making measurable year-on-year progress. Also, we aim to create an inclusive work environment and we will not tolerate racism, discrimination or harassment of any kind. We have programs in place focused on diversity, inclusion and equality.
https://www.nxp.com/company/about-nxp/diversity-equality-and-inclusion:DIVERSITY-AND-INCLUSION
This internship offers an opportunity to work at the intersection of materials science, reliability engineering, and advanced simulation, contributing directly to the development of next-generation semiconductor packaging technologies and predictive reliability methodologies.
More information about NXP in the Netherlands...
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